International Eurasian Academy of Sciences, IEAS

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Shaojun WEI
Academician
Shaojun WEI
Profile:
Elected Academician of the International Eurasian Academy of Sciences in 2020, Professor Shaojun Wei is a distinguished Chinese microelectronics engineer whose research and professional work have focused on integrated circuit design, VLSI design methodology, reconfigurable computing, and software-defined chip architecture. Born in May 1958 in Beijing, he received his Master of Engineering from Tsinghua University in 1984 and his Doctor of Applied Sciences from the Faculté Polytechnique de Mons, Belgium, in 1991. He subsequently held research and academic positions in Belgium before returning to China in 1995 to join Tsinghua University. From 1998 to 2005, he served in a series of executive positions at Datang Telecom Technology Co., Ltd., including Vice President, President, and CEO, and was involved in establishing its microelectronics subsidiary. He currently serves as Tenured Professor at the School of Integrated Circuits and Director of the Institute of Microelectronics at Tsinghua University, as well as Adjunct Professor at Peking University. He is also a member of the National Advisory Committee on Integrated Circuit Industry Development, Chief Technologist of the National Major Science and Technology Project for Core Electronic Devices, High-end General Chips and Basic Software, and Vice Chairman of the China Semiconductor Industry Association. He is an IEEE Fellow and a recipient of the State Council Special Allowance and the National May 1 Labour Medal.

Professor Wei’s research has centred on VLSI system-on-chip design, electronic design automation, application-specific integrated circuits for communications, and reconfigurable computing. He proposed the architecture and design paradigm of software-defined chips, in which software dynamically determines chip functionality, combining the efficiency of dedicated hardware with the flexibility of programmable processors. His engineering work also contributed to the development and volume production of smart-card and electronic identity chips for computing and communication applications, recognised by the IEEE Circuits and Systems Society Industry Pioneer Award in 2020. He has received a National Technological Invention Award (Second Prize), a National Science and Technology Progress Award (Second Prize), eight provincial and ministerial first prizes, and two China Patent Gold Awards. He has published more than 300 scientific papers and six monographs and holds more than 130 invention patents, including 18 in the United States. Through sustained research, industrial technology development, and leadership of national programmes, Professor Wei has contributed to connecting integrated circuit design methodology with semiconductor technology and industrial development in China, as well as to advances in reconfigurable computing, smart-card technology, and IC design education.